An intelligent infrared soldering station with real-time temperature monitoring, optical alignment system, rapid heating, and cooling
Features
Real-time Temperature Monitoring
Real-time temperature display with automatic curve analysis function.
Optical Alignment System
High-definition CCD (2m pixels) digital imaging, automatic optical zoom system, manual control and laser red-dot alignment.
Rapid heating and cooling
The IR preheating zone is heated by a medium wave ceramic infrared heating plate, a multi-functional movable PCB fixing bracket, and a BGA bottom support frame with laminar integrated cooling fan.
Specification
Power Supply |
AC 220V +/- 10% 50/60Hz |
Power |
5.65KW (max) Top Heater: 1.45KW Bottom Heater: 1.2KW IR Preheater: 2.7KW Other: 0.3KW |
PCB Size |
Max: 412 x 370 mm Min: 6 x 6 mm |
BGA Chip Size |
Max: 60 x 60 mm Min: 2 x 2 mm |
IR Heater Size |
285 x 375 mm |
Temperature Sensor |
1 |
Operation Method |
7" HD Touch Screen |
Control System |
Autonomous heating control system V2 |
Display System |
15" SD Industrial Display (720P) |
Alignment System |
2 million pixel SD Digital Imaging System. Automatic Optical Zoom with Laser Red-Dot Indicator |
Vacuum Adsorption |
Automatic |
Alignment Accuracy |
+/- 0.02 mm |
Temperature Control |
K-type Thermocouple Closed-Loop Control with Accuracy up to +/- 3°C |
Feeding Device |
No |
Positioning |
V-groove with Universal Fixture |
Dimensions |
685 L x 633 W x 850 H mm |
Weight |
76kg |