Automatic X-ray inspection is a process that uses X-rays to inspect products for defects or foreign objects. Even the smallest irregularities, such as cracks, voids, or contaminants can be detected using this system. These system play a crucial role in the electronics manufacturing and semiconductor industries, ensuring the quality and reliability of electronic components.
Benefits of this system include:
High Quality Products
By identifying defects or inconsistencies in the manufacturing process, companies can make necessary adjustments to prevent future issues. Whether it’s detecting air pockets in semiconductor solder joints or identifying cracks in electronic component, X-ray inspection serves to check for any defective PCB before it is assembled into your final electronic product. This approach ensures that customers receive products of the highest standard, ultimately enhancing customer satisfaction and trust in the brand.
Identify Contamination, Scratches or Misalignment
Automatic X-ray inspection can identify small foreign objects that fall on your PCB, even specks of dust, metal, glass or plastic that can contaminate components during production. While big contaminants can be easily spotted with the human eye, small particles or scratches cannot be easily viewed. Inspection of the alignment of micro components can also be done with ease. The X-ray system helps reduce human error and eye fatigue, ensuring a lower defect rate and a higher yield rate.
Improved Efficiency
These systems are designed to handle high volumes of components quickly, with the capability to inspect numerous units per minute, or even seconds. In electronics manufacturing, where PCBs and components are produced in large batches, it allows for continuous, automated inspection, ensuring that production lines run smoothly with minimal interruptions. Automatic X-Ray inspection requires little to no human supervision. This helps maximize efficiency by reducing downtime and increasing output.
Non Destructive Inspection
By using X-ray inspection system, it can "scan" the outer layers to reveal internal structures and potential defects without damaging PCB. This system is essential for detecting hidden defects, such as solder voids, misplaced components, or circuit flaws, ensuring the reliability and quality of the electronic assembly while preserving the integrity of the board.
SEAMARK X-Ray Inspection Systems
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| X1200 Precise Micro-Focus Offline X-RAY Inspection |
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| X7600 Micro-Focus Offline X-RAY Inspection |
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| X6600H Micro-Focus Offline X-RAY Inspection |
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| X6600M/BM Universal Micro-focus Offline X-RAY Inspection |
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| Precision Micro-Focus Offline X-RAY Inspection |
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| X5600 Small Micro-Focus Offline X-RAY Inspection |
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