PRODUCE THOUGH-HOLES AND BLIND VIAS
All holes on a circuit board can be drilled using LPKF's circuit board plotters or LPKF ProtoLasers.
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Laser Drilling An efficient technology for producing drilled microvias with diameters of less than 200 μm. The LPKF ProtoLaser can be used to process a range of board substrates, eg. FR4, FR5, RCC, Teflon®, and Thermount®. |
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Mechanical Drilling LPKF CircuitPro automatically converts these drill holes into milling circles. The software also stores drilling parameters thereby preventing additional user intervention. |
LPKF ProtoLasers
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ProtoLaser S4 Structure, engrave and cut in a single operation |
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ProtoLaser R4 Laser ablation with practically no heat transfer |
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ProtoLaser U4 Compact laser system producing fine, precise structures |
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ProtoLaser ST High performance, table top compact laser for any lab |
LPKF Circuit Board Plotters (ProtoMat)
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ProtoMat E44 For cost effective, professional in-house prototyping |
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ProtoMat S64 All-rounder for rapid PCB prototyping |
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ProtoMat S104 Specialist for RF and microwave applications |